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Z SOLVENT-FREE HPL ADHESIVE NOW IN PATENTED CANISTER

Rockland, MA (October 18, 2006): ITW TACC, makers of Z Solvent-Free Postformable Adhesive for HPL, has developed a self-contained canister system for easy application of its solvent-free adhesive.

Z Canister is a patented new solvent-free system in cylinders with 35 lbs. of high-strength neoprene rubber, providing the same yield as up to four solvent-based canisters. Z Solvent-Free Postformable Adhesive, which is used on high-pressure laminate, decorative metals, phenolic-backed veneers and many other substrates, is a solution to regulatory compliance because it contains zero solvents, zero VOCs, zero HAPs, zero methylene chloride and zero flammability.

Z Solvent-Free Postformable Adhesive already comes in easily recyclable 5 gallon plastic pails and 55 gallon plastic-lined drums. The Z Canister is actually re-used rather than recycled.

ITW TACC, a division of Illinois Tool Works, develops and manufactures brands of high performance adhesives used in woodworking, building construction, HVAC, roofing, manufactured housing, transportation and marine. For more information, contact ITW TACC Product Development Manager Bill Arscott at 1-800-503-6991, ext. 471 or barscott@itwtacc.com.


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CONBOND, Foamseal, Miracle, STA'PUT, TACC, TOP GRIP, MASON BOND, SEA GRIP and Z are registered trademarks of ITW TACC.
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